The brand is KUKDO, the series is KD Series, the model is KD-214M, with the core word Medium-Molecular-Weight Solid Bisphenol A Epoxy Resin. It is a general-purpose solid epoxy resin developed for high-performance protective coatings, presenting as pale yellow flakes. With stable epoxy equivalent and excellent melt fluidity
Balanced molecular weight - Combines film hardness and flexibility, with excellent impact and crack resistance.
Stable epoxy equivalent - Controllable reactivity, ensuring uniform coating performance in mass production.
Good melt fluidity - Uniform processing dispersion, superior coating leveling, and flat forming appearance.
Strong chemical resistance - Resists erosion from various chemical media after curing, with long-lasting protective effect.
Wide compatibility - Has good adaptability with amino, phenolic, isocyanate-based curing agents.
Industrial protective coatings - Anti-corrosion primers and topcoats for mechanical equipment and steel structures.
High-end powder coatings - High-performance decorative and protective coatings for auto parts and construction machinery.
Coil coatings - Precoated protective and decorative coatings for metal coils used in construction and home appliances.
Pipeline anti-corrosion - Inner wall anti-corrosion linings and external protective coatings for transport pipelines and steel drums.
Epoxy composite materials - Matrix resin raw material for epoxy floors and FRP products.
| Type | Medium-Molecular-Weight Solid Bisphenol A Epoxy Resin |
| Chemical Category | Unmodified Bisphenol A Epoxy Resin |
| Epoxy Equivalent (g/eq) | 600-700 |
| Softening Point (℃) | 95-105 |
| Melt Viscosity (cps@125℃) | 1500-3000 |
| Volatile Content (wt%) | ≤0.5 |
| Hydrolyzable Chlorine (wt%) | ≤0.02 |
| Color (Platinum-Cobalt Scale) | ≤150 |
| Tensile Strength (MPa) | ≥82 |
| Flexural Strength (MPa) | ≥115 |
Q1: What is the primary application of KD-214M in epoxy systems?
A: KD-214M is a solid bisphenol-A based epoxy resin commonly used as a reactive binder or matrix component in powder coatings, electrical encapsulants, and high-performance composite formulations where thermal stability and mechanical strength are required.
Q2: How does KD-214M differ from liquid epoxy resins like DGEBA?
A: Unlike low-viscosity liquid epoxies, KD-214M is a crystalline solid at room temperature, offering improved handling safety, reduced volatility, and enhanced storage stability—making it particularly suitable for solvent-free or low-VOC applications such as thermosetting powder coatings.
Q3: What type of curing agents are typically compatible with KD-214M?
A: KD-214M is compatible with common amine-based hardeners (e.g., dicyandiamide, aromatic diamines), anhydrides, and phenolic novolacs. Selection depends on the desired cure schedule, final properties, and end-use requirements such as heat resistance or electrical insulation performance.
Q4: Is KD-214M suitable for food-contact or pharmaceutical applications?
A: KD-214M is not pre-certified for direct food-contact or pharmaceutical use. Formulators must conduct full regulatory evaluation—including migration testing and compliance verification—based on the final cured system and applicable regional regulations before such use.
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