High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy handling, mixing, and impregnation in composite processes.
Superior electrical insulation properties and low dielectric loss, suitable for high-reliability electronic encapsulation.
Good thermal stability with glass transition temperature (Tg) of cured systems typically exceeding 130°C.
Electrical & electronics encapsulation for transformers, reactors, and power modules.
High-voltage insulators and bushings requiring long-term tracking resistance and hydrophobicity.
Structural adhesives for aerospace and automotive bonding where thermal cycling resistance is critical.
Wind turbine blade matrix resin in pultrusion and infusion processes.
Coating resins for corrosion-resistant industrial linings and tank interiors.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, homogeneous, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Storage Stability | ≥ 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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