Evonik Dynasylan 88445 is a specialized tris-silane adhesion promoter engineered to deliver exceptional bonding performance on difficult substrates, particularly in high-temperature applications and hot melt adhesives where thermal stability is critical.
Thermal Stability - Maintains performance stability up to 200°C
Low Volatility - High boiling point ensures minimal evaporation during processing
Enhanced Adhesion - Improves bonding on challenging substrate surfaces
Excellent Compatibility - Works with most hot melt adhesive resins
Superior Retention - Optimized silane retention in hot melt formulations
Hot Melt Adhesives - Adhesion promoter for high-temperature bonding applications
Silicone Rubber - Bonding enhancer for RTV silicone formulations
Automotive Sealing - Adhesion promoter for high-temperature gaskets and seals
Electronic Encapsulation - Bonding agent for electronic component protection
Industrial Assembly - Adhesion promoter for high-performance industrial bonding
Chemical Name | Tris(trimethoxysilylpropyl) isocyanurate |
Appearance | Clear liquid |
Specific Gravity (25°C) | 1.17 |
Viscosity | 95 cSt |
Flash Point | 102°C |
Boiling Point | 230°C (0.05mmHg) |
Thermal Stability | Up to 200°C |
Functionality | Tri-silane |
Recommended Usage | 0.5-2.0% in formulations |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China