Fast-reacting aliphatic amine-based curing agent for ambient and low-temperature cure profiles.
Excellent compatibility with standard epoxy resins, enabling uniform crosslinking without phase separation.
Low viscosity (250–350 mPa·s at 25°C) ensures easy metering, mixing, and air-release during processing.
Low volatility and non-crystallizing formulation enhances shelf stability and handling safety.
Delivers high glass transition temperature (Tg > 85°C) and superior chemical resistance in cured networks.
Structural adhesives for automotive and aerospace bonding assemblies.
Electrical encapsulants and potting compounds requiring rapid throughput and thermal reliability.
High-performance coating systems for industrial flooring and protective linings.
Composite matrix resins in wind blade and marine applications.
Repair mortars and grouts where fast strength development is critical.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (25°C) | 0.92–0.95 g/cm³ |
| Amine Value | 210–230 mg KOH/g |
| Viscosity (25°C) | 250–350 mPa·s |
| Primary Applications | Epoxy resin curing for adhesives, coatings, composites, and encapsulants |
| Key Features | Ambient-cure capability, low exotherm, good flexibility retention |
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E-mail: wangxingqiang@ericwchem.com
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