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Fast-reacting aliphatic amine-based curing agent for room-temperature and elevated-temperature epoxy systems.
Low viscosity (200–300 mPa·s at 25°C) ensures excellent mixability and air-release in formulated resins.
Superior chemical resistance—particularly to alkalis, solvents, and mild acids—after full cure.
Low volatility and reduced amine odor compared to conventional DETA-type hardeners, enhancing workplace safety.
Enables high glass transition temperature (Tg > 85°C) and excellent mechanical strength in cured epoxy networks.
Structural adhesives for aerospace and automotive bonding applications.
High-performance protective coatings for concrete flooring and industrial steel substrates.
Electrical encapsulants and potting compounds requiring thermal stability and dielectric integrity.
Composite matrix resins in wind turbine blade and marine component manufacturing.
Repair mortars and grouts where rapid strength development and low shrinkage are critical.
| Chemical Type | Modified aliphatic polyamine |
| Product Form | Liquid |
| Appearance | Clear, pale yellow liquid |
| Density (25°C) | 0.94–0.96 g/cm³ |
| Viscosity (25°C) | 220–280 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Reactivity with DGEBA Epoxy | Full gel time: 15–25 min at 25°C; Tg (DSC): 86–92°C |
| Storage Stability | ≥12 months in sealed container at 15–25°C |
Q1: What types of resins is HDX-75M Curing Agent compatible with?
A: HDX-75M is specifically formulated for use with epoxy resins, including bisphenol-A, bisphenol-F, and novolac-based systems. It demonstrates good reactivity and compatibility in both liquid and solid epoxy formulations, particularly where enhanced thermal stability and low-color cure profiles are desired.
Q2: How does HDX-75M affect pot life and cure speed compared to conventional amine curing agents?
A: HDX-75M offers a balanced reactivity profile—providing extended working time at ambient temperatures while enabling efficient post-cure development of mechanical and chemical resistance. Its latency allows for improved formulation handling without sacrificing final network performance.
Q3: Is HDX-75M suitable for applications requiring low volatility and minimal odor?
A: Yes. HDX-75M is a low-volatility, non-amine-adduct curing agent designed to minimize workplace exposure concerns and reduce odor impact during processing—making it well-suited for indoor applications and environments with strict industrial hygiene requirements.
Q4: What is the typical dosage range for HDX-75M in epoxy formulations?
A: Dosage depends on the specific resin system, target properties, and processing conditions. HDX-75M is typically used at low concentrations—generally ranging from 0.1% to 2% by weight relative to the epoxy resin—and should be optimized through small-scale trials to achieve desired gel time, hardness development, and final crosslink density.
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