Low-viscosity, liquid amine-based curing agent for enhanced processability and easy metering.
Enables rapid room-temperature cure with excellent early strength development.
Delivers high thermal stability and superior chemical resistance in cured epoxy systems.
Offers low exotherm profile, reducing risk of cracking and internal stress in thick-section castings.
Compatible with standard bisphenol-A and novolac epoxy resins for broad formulation flexibility.
Electrical potting and encapsulation of transformers, sensors, and power electronics.
Structural adhesives for aerospace and transportation composites assembly.
High-performance flooring and industrial coatings requiring rapid return-to-service.
Composite tooling and mandrel materials for wind energy and automotive mold applications.
Repair mortars and grouts for concrete infrastructure rehabilitation.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Amber to light brown transparent liquid |
| Primary Applications | Potting, encapsulation, adhesives, coatings, composites |
| Key Features | Room-temperature cure, low viscosity, low exotherm, high Tg capability |
| Benefits | Improved handling, reduced cycle time, enhanced durability, excellent adhesion |
| Storage Stability | Stable under dry, cool conditions (≤25°C) for ≥12 months in unopened containers |
| Reactivity Profile | Moderate reactivity with standard DGEBA epoxy resins at ambient temperature |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China