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Fast-reacting aliphatic amine-based curing agent for room-temperature and elevated-temperature epoxy systems.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Delivers high glass transition temperature (Tg) and superior mechanical strength in cured networks.
Low viscosity enables easy metering, mixing, and air-release during processing.
Good chemical resistance to solvents, acids, and alkalis after full cure.
Structural adhesives for automotive and aerospace bonding.
High-performance potting and encapsulation compounds for electronics.
Industrial flooring and protective coatings requiring rapid turnaround.
Composite matrix resins for pultrusion and filament winding processes.
Electrical insulation systems in transformers and busbar assemblies.
| Chemical Type | Aliphatic polyamine |
| Product Form | Liquid |
| Appearance | Clear to pale yellow transparent liquid |
| Viscosity (25°C) | 150–250 mPa·s |
| Density (25°C) | 0.92–0.96 g/cm³ |
| Amine Value | 380–420 mg KOH/g |
| Reactivity Profile | Medium-fast cure at ambient temperature; accelerated cure above 60°C |
| Primary Applications | Adhesives, encapsulants, coatings, composites |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
