Fast-reacting aliphatic amine-based curing agent for room-temperature and elevated-temperature epoxy systems.
Low viscosity (< 500 cP at 25°C) ensures excellent mixability and air-release in formulated resins.
Superior chemical resistance—particularly to alkalis, solvents, and mild acids—after full cure.
Low volatility and non-hazardous classification per GHS (no skin sensitization or acute toxicity warnings).
Enables high glass transition temperature (Tg > 120°C) in cured epoxy networks without post-baking.
Structural adhesives for aerospace composite bonding and metal-to-composite assembly.
High-performance coating systems for industrial flooring and corrosion-resistant tank linings.
Electrical encapsulation and potting compounds for power electronics and EV battery modules.
Wind turbine blade adhesive joints and repair formulations requiring rapid green strength development.
Tooling and mold-making resins where dimensional stability and low exotherm are critical.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Clear, pale yellow liquid |
| Density (25°C) | 0.92–0.94 g/cm³ |
| Viscosity (25°C) | 350–450 cP |
| Amine Value | 210–230 mg KOH/g |
| Primary Applications | Epoxy resin curing for structural adhesives, coatings, and composites |
| Key Features | Room-temperature cure, low odor, hydrolytic stability |
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