Fast-reacting aliphatic amine-based curing agent for room-temperature and elevated-temperature epoxy systems.
Low viscosity (200–300 mPa·s at 25°C) enabling excellent mixing efficiency and improved filler dispersion.
Low volatility and reduced amine odor, enhancing workplace safety and operator comfort during handling.
Excellent chemical resistance post-cure—particularly to alkalis, solvents, and mild acids.
Provides high glass transition temperature (Tg > 85°C) and superior mechanical strength in cured epoxy networks.
Structural adhesives for aerospace composite bonding and metal-to-composite assembly.
High-performance protective coatings for offshore platforms, chemical processing equipment, and concrete substrates.
Electrical encapsulation and potting compounds requiring rapid throughput and thermal stability.
Wind turbine blade bonding and repair formulations demanding low exotherm and extended working life.
Tooling and mold-making resins where dimensional stability and surface hardness are critical.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (25°C) | 0.92–0.95 g/cm³ |
| Viscosity (25°C) | 200–300 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Reactivity with DGEBA Epoxy | Full cure achievable in 24 h at 25°C or 4 h at 80°C |
| Primary Applications | Epoxy adhesives, coatings, composites, encapsulants |
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