Non-migrating, permanent antistatic performance through covalent bonding with polymer matrices.
Excellent thermal stability suitable for high-temperature processing up to 300 °C.
Low volatility and minimal plate-out, ensuring consistent performance in extrusion and injection molding.
Compatible with engineering thermoplastics including polyamide (PA6, PA66), polybutylene terephthalate (PBT), and polycarbonate (PC).
Halogen-free formulation supporting RoHS and REACH compliance for global electronics and automotive applications.
Antistatic components for automotive interior parts (e.g., trim, connectors, sensor housings).
ESD-safe housings and structural parts in consumer electronics and office equipment.
Static-dissipative trays, carriers, and packaging for semiconductor handling and cleanroom environments.
Industrial conveyor components requiring controlled surface resistivity in dust-sensitive manufacturing lines.
Medical device enclosures where electrostatic discharge (ESD) control is critical for sensor integrity and operator safety.
| Chemical Type | Reactive oligomeric phosphonate ester |
| Product Form | Pellets |
| Appearance | Off-white to light beige granules |
| Primary Applications | Engineering thermoplastics (PA, PBT, PC), ESD/EMI shielding composites |
| Key Features | Permanent antistatic effect, thermal stability, low extractables |
| Recommended Loading Level | 5–15 wt% depending on base resin and target surface resistivity |
| Storage Conditions | Store in original sealed container at 5–30 °C, protect from moisture |
| Regulatory Status | Compliant with EU REACH, RoHS 2, and non-ELV restricted substances |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China