Aliphatic polyamine-based curing agent offering excellent flexibility and impact resistance in epoxy systems.
Low viscosity enables easy handling, precise metering, and superior wetting of fillers and reinforcements.
Fast ambient-cure kinetics without requiring elevated temperatures — ideal for energy-efficient manufacturing.
Low volatility and low skin sensitization potential, supporting improved workplace safety and regulatory compliance.
Good chemical resistance post-cure, especially to alkalis, solvents, and moisture in demanding industrial environments.
Structural adhesives for automotive and transportation assembly.
High-performance flooring and industrial coatings for warehouses and cleanrooms.
Electrical encapsulants and potting compounds for power electronics and LED modules.
Repair mortars and grouts in civil engineering and infrastructure maintenance.
Composite matrix resins for wind turbine blade bonding and marine laminates.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Viscosity (25 °C) | Approx. 300–500 mPa·s |
| Amine Value | 240–270 mg KOH/g |
| Density (20 °C) | 0.92–0.96 g/cm³ |
| Flash Point (PMCC) | ≥ 100 °C |
| Primary Applications | Epoxy resin curing for adhesives, coatings, composites and potting |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China