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High reactivity with standard bisphenol-A and bisphenol-F epoxy resins.
Enables fast ambient-cure formulations without external heat input.
Delivers excellent chemical resistance, particularly to alkalis and solvents.
Low viscosity improves blend homogeneity and facilitates processing in automated systems.
Non-blushing formulation ensures superior surface aesthetics in clear-coat applications.
Industrial flooring systems requiring rapid return-to-service.
Electrical encapsulation and potting of power electronics and transformers.
High-performance adhesives for metal, composite, and concrete bonding.
Protective coatings for marine and offshore infrastructure.
Composite matrix resins for wind turbine blade manufacturing.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (20 °C) | 0.94–0.96 g/cm³ |
| Viscosity (25 °C) | 250–450 mPa·s |
| Amine Value | 280–320 mg KOH/g |
| Reactivity Profile | Fast ambient cure (tack-free in ≤4 h at 23 °C / 50% RH) |
| Primary Applications | Structural adhesives, protective coatings, electrical encapsulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
