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Low-viscosity polyamide curing agent enabling excellent flow and wetting of substrates.
Offers extended pot life at ambient temperatures for improved processing flexibility.
Delivers robust mechanical properties and chemical resistance in cured epoxy systems.
Compatible with standard bisphenol-A and bisphenol-F epoxy resins.
Non-hazardous classification under GHS for transport and handling (non-ADR, non-IMDG).
Industrial floor coatings requiring durability and abrasion resistance.
Marine and offshore protective coatings for steel structures.
Electrical insulation systems in transformers and encapsulation compounds.
Adhesives and structural bonding formulations for metal and composite substrates.
Repair mortars and high-performance grouts for civil engineering applications.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Amber to light brown viscous liquid |
| Amine Value (mg KOH/g) | 340–380 |
| Viscosity @ 25°C (mPa·s) | 1,800–2,500 |
| Density @ 25°C (g/cm³) | 0.96–0.99 |
| Primary Applications | Epoxy coating, adhesive, and flooring systems |
| Key Features | Low exotherm, good flexibility, moisture tolerance |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
