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Highly flexible amide-based curing agent offering extended pot life and low exotherm for thick-section casting.
Provides excellent adhesion to diverse substrates including metals, concrete, and composite surfaces.
Delivers good chemical resistance—particularly to alkalis, solvents, and mild acids—after full cure.
Enables ambient-temperature cure with acceptable physical properties; also compatible with elevated temperature post-cure for enhanced performance.
Low volatility and non-hazardous classification under standard transport regulations (non-ADR, non-IMDG Class 9).
Structural adhesive formulations for transportation and industrial assembly.
Casting and encapsulation of electrical and electronic components requiring thermal stability and dielectric integrity.
Flooring and protective coatings for industrial concrete surfaces in manufacturing and warehousing facilities.
Repair mortars and grouts for civil infrastructure maintenance and rehabilitation projects.
| Chemical Type | Aliphatic polyamide |
| Product Form | Liquid |
| Appearance | Amber to light brown viscous liquid |
| Primary Applications | Structural adhesives, castings, coatings, mortars |
| Key Features | Low exotherm, ambient cure capability, good flexibility, substrate adhesion |
| Benefits | Reduced thermal stress in thick sections, ease of processing, broad compatibility with DGEBA resins |
| Storage Stability | 12 months in original unopened container at 15–25°C |
| Recommended Mix Ratio (by weight) with EPON™ 828 | 100 : 45–55 |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
