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High reactivity with standard bisphenol-A and bisphenol-F epoxy resins.
Enables fast ambient-cure or low-temperature cure profiles without external heat input.
Delivers excellent chemical resistance and mechanical strength in cured networks.
Low viscosity for easy handling, metering, and homogeneous mixing with epoxy systems.
Compatible with common fillers, pigments, and additives used in industrial formulations.
Structural adhesives for automotive and transportation assembly.
Electrical encapsulation and potting compounds for power electronics.
High-performance coatings for metal substrates and industrial equipment.
Composite matrix resins for wind energy and lightweight structural components.
Flooring and grouting systems requiring rapid turnaround and durability.
| Chemical Type | Amine-based aliphatic curing agent |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (20 °C) | ~0.95–0.98 g/cm³ |
| Viscosity (25 °C) | 200–400 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Reactivity Profile | Fast-reacting at ambient temperature |
| Primary Applications | Adhesives, coatings, composites, encapsulants |
Q1: What is the primary chemical class of Evonik Epoxy Curing Agent 2771?
A: Evonik Epoxy Curing Agent 2771 is a latent, amine-based curing agent specifically designed for epoxy resin systems, offering controlled reactivity and extended pot life at ambient temperatures.
Q2: At what temperature range does this curing agent typically initiate crosslinking?
A: Crosslinking is thermally activated, generally beginning in the range of 120–150 °C, with full cure achieved after sustained heating at elevated temperatures—exact profiles depend on formulation and thermal schedule.
Q3: Is this curing agent compatible with standard bisphenol-A and bisphenol-F epoxy resins?
A: Yes, it demonstrates broad compatibility with conventional liquid and solid bisphenol-A/F epoxy resins, as well as novolac epoxies, making it suitable for high-performance composites, electrical encapsulants, and powder coatings.
Q4: How should Evonik Epoxy Curing Agent 2771 be stored to maintain stability?
A: Store in original sealed containers under dry, cool conditions (below 25 °C) and protect from moisture and direct sunlight; prolonged exposure to humidity or elevated temperatures may reduce latency and shelf life.
Q5: Can this curing agent be used in powder coating formulations?
A: Yes, its latent reactivity, low volatility, and excellent storage stability make it well-suited for one-component (1K) epoxy and hybrid powder coating systems requiring long shelf life and sharp melt-cure behavior.
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