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High reactivity with standard bisphenol-A and bisphenol-F epoxy resins.
Enables fast ambient-cure or low-temperature cure profiles without external heat input.
Delivers excellent chemical resistance and mechanical strength in cured networks.
Low viscosity for easy handling, metering, and homogeneous mixing with epoxy systems.
Compatible with common fillers, pigments, and additives used in industrial formulations.
Structural adhesives for automotive and transportation assembly.
Electrical encapsulation and potting compounds for power electronics.
High-performance coatings for metal substrates and industrial equipment.
Composite matrix resins for wind energy and lightweight structural components.
Flooring and grouting systems requiring rapid turnaround and durability.
| Chemical Type | Amine-based aliphatic curing agent |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (20 °C) | ~0.95–0.98 g/cm³ |
| Viscosity (25 °C) | 200–400 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Reactivity Profile | Fast-reacting at ambient temperature |
| Primary Applications | Adhesives, coatings, composites, encapsulants |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
