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Latent reactivity enables extended pot life at ambient temperature, supporting complex processing and large-part fabrication.
Activates reliably upon thermal cure (typically 120–150 °C), delivering consistent epoxy network formation without premature gelation.
Low volatility and minimal odor enhance workplace safety and compliance with industrial hygiene standards.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins ensures broad formulation flexibility.
Delivers high glass transition temperature (Tg) and superior mechanical performance in cured composites.
Aerospace composite tooling and structural components requiring dimensional stability and thermal resistance.
Wind turbine blade bonding and infusion systems where controlled reactivity and low exotherm are critical.
Electrical insulation systems for high-voltage equipment and encapsulation of power electronics.
Automotive under-hood components demanding long-term durability at elevated service temperatures.
High-performance adhesives and prepreg systems for industrial and defense applications.
| Chemical Type | Dicyandiamide-based latent hardener |
| Product Form | White to off-white crystalline powder |
| Appearance | Free-flowing crystalline solid |
| Primary Applications | Epoxy resin curing for composites, adhesives, and coatings |
| Key Features | Latent, thermally activated, low volatility, high Tg capability |
| Benefits | Extended shelf life, improved processing window, reduced VOC emissions |
| Recommended Cure Schedule | 120 °C for 2 hours, or 150 °C for 1 hour |
| Storage Conditions | Store in original sealed container below 25 °C, protect from moisture |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
