Low-viscosity liquid formulation enabling excellent mixing and processing with standard epoxy resins.
Room-temperature curing capability with balanced reactivity for efficient production cycles.
Provides high crosslink density, resulting in superior mechanical strength and chemical resistance.
Low exotherm profile during cure, reducing thermal stress and minimizing warpage in thick-section applications.
Compatible with bisphenol-A and novolac epoxy systems without requiring solvent dilution.
Electrical encapsulation and potting compounds for power electronics and transformers.
High-performance adhesives for automotive structural bonding and composite assembly.
Protective coatings for industrial flooring and corrosion-resistant tank linings.
Composite matrix resin systems in wind turbine blade manufacturing.
Tooling and mold-making materials requiring dimensional stability and low shrinkage.
| Chemical Type | Amine-based aliphatic polyamine adduct |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, free of sediment or haze |
| Primary Applications | Structural adhesives, electrical encapsulants, protective coatings |
| Key Features | Room-temperature cure, low viscosity, low odor, non-crystallizing |
| Benefits | Improved handling safety, extended pot life, enhanced interfacial adhesion |
| Storage Condition | Store at 5–25°C in original sealed container; protect from moisture |
| Shelf Life | 12 months from date of manufacture under recommended storage |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China