English
Español
tiếng việt
русский
Low-viscosity liquid polyamide offering excellent compatibility with epoxy resins.
Enables room-temperature curing with good pot life and extended working time.
Delivers high flexibility, impact resistance, and adhesion to diverse substrates.
Provides superior chemical resistance, particularly to alkalis and solvents.
Halogen-free formulation supporting sustainable and regulatory-compliant formulations.
Industrial maintenance coatings for steel and concrete infrastructure.
Electrical encapsulation and potting compounds for transformers and busbars.
Adhesives and sealants requiring toughness and environmental durability.
Marine and offshore protective coatings exposed to humid and saline conditions.
Repair mortars and grouts for civil engineering and structural rehabilitation.
| Chemical Type | Polyamide adduct |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, low-viscosity liquid |
| Amine Value | 340–380 mg KOH/g |
| Viscosity (25°C) | 800–1,200 mPa·s |
| Density (20°C) | 0.96–0.99 g/cm³ |
| Primary Applications | Epoxy resin curing for coatings, adhesives, and composites |
| Key Features | Room-temperature cure, flexibility, chemical resistance, halogen-free |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
