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High reactivity with standard epoxy resins, enabling fast gelation and reduced cycle times.
Excellent chemical resistance, particularly to solvents, acids, and alkalis in cured systems.
Low viscosity for easy handling, metering, and homogeneous blending without solvent addition.
Good flexibility and impact resistance in final cured networks without compromising hardness.
Halogen-free formulation supporting sustainability goals and compliance with RoHS and REACH.
Electrical encapsulation and potting compounds for power electronics and sensors.
High-performance adhesives for automotive structural bonding and composite assembly.
Protective coatings for industrial flooring, marine decks, and chemical containment linings.
Wind turbine blade bonding and repair systems requiring rapid turnaround and durability.
Composite matrix resins in aerospace and rail interior components.
| Chemical Type | Amine-based aliphatic curing agent |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (20 °C) | 0.94–0.97 g/cm³ |
| Viscosity (25 °C) | 250–400 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Primary Applications | Structural adhesives, electrical encapsulants, protective coatings |
| Key Features | Fast-curing, low-VOC, halogen-free, excellent adhesion to metals and composites |
Q1: What is the primary chemical class of Evonik Epoxy Curing Agent 910?
A: Evonik Epoxy Curing Agent 910 is a latent amine-based curing agent, specifically formulated as a modified aliphatic amine adduct designed for controlled reactivity and extended pot life in epoxy systems.
Q2: How does this curing agent affect the thermal and mechanical performance of cured epoxy resins?
A: When fully cured, formulations using Evonik Epoxy Curing Agent 910 typically deliver good glass transition temperature (Tg), enhanced toughness, and improved chemical resistance compared to standard aliphatic amines—while maintaining favorable processing characteristics such as low viscosity and minimal volatility.
Q3: Is this curing agent suitable for one-component (1K) epoxy formulations?
A: Yes—Evonik Epoxy Curing Agent 910 is engineered for use in latent 1K epoxy systems. Its reactivity remains suppressed at ambient temperatures, enabling stable shelf life, and it activates reliably upon thermal triggering (typically above 120 °C).
Q4: What types of epoxy resins is it most commonly paired with?
A: It demonstrates broad compatibility with standard liquid and solid bisphenol-A and bisphenol-F based epoxy resins, as well as many novolac and cycloaliphatic epoxies—making it suitable for coatings, adhesives, and electrical encapsulation applications.
Q5: How should dosage be determined for optimal cure performance?
A: Dosage depends on formulation requirements and target properties, but it is typically used at low concentrations relative to resin weight. Users are advised to conduct small-scale cure studies—including DSC analysis and mechanical testing—to establish the appropriate stoichiometric balance and thermal profile for their specific system.
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