Highly efficient crosslinking agent for epoxy resins, enabling rapid cure at ambient to moderate temperatures.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy systems without phase separation.
Low volatility and low odor—enhances workplace safety and supports VOC-compliant formulations.
Provides superior thermal stability and glass transition temperature (Tg) in cured networks.
Non-halogenated, REACH-compliant chemistry supporting sustainable industrial material design.
Electronics encapsulants and underfill materials requiring fine-pitch reliability and low ionic impurity.
High-performance structural adhesives for automotive and aerospace composites.
Electrical insulation coatings and potting compounds for power electronics and transformers.
UV/thermal dual-cure hybrid systems in advanced printed circuit board (PCB) manufacturing.
High-gloss, chemically resistant protective coatings for industrial equipment and metal substrates.
| Chemical Type | Triazine-based amine adduct |
| Product Form | Pale yellow to light amber viscous liquid |
| Appearance | Clear, homogeneous liquid (no sediment or haze) |
| Primary Applications | Epoxy resin curing agent for high-Tg, low-VOC thermosets |
| Key Features | Ambient-curable, non-crystallizing, moisture-stable |
| Benefits | Extended pot life, excellent adhesion to metals and composites, low exotherm |
| Storage Conditions | Store in sealed containers at 5–30°C; protect from moisture and direct sunlight |
| Regulatory Compliance | REACH registered; RoHS compliant; no SVHCs above threshold |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China