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Fast-reacting aliphatic amine-based curing agent for rapid epoxy system development.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Provides superior mechanical strength and chemical resistance in cured composites.
Low viscosity enables easy metering, mixing, and processing at ambient temperatures.
Meets RoHS compliance requirements for restricted substances in industrial applications.
Electrical encapsulation and potting compounds for PCBs and power modules.
Structural adhesives in automotive and rail interior bonding assemblies.
Coating systems for corrosion protection on steel substrates in industrial environments.
Composite matrix formulations for wind turbine blade tooling and repair resins.
Underfill and conformal coating materials in electronics manufacturing.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Clear to pale yellow transparent liquid |
| Density (25°C) | 0.92–0.96 g/cm³ |
| Viscosity (25°C) | 180–250 mPa·s |
| Amine Value | 320–360 mg KOH/g |
| Reactivity Profile | Room temperature curable with moderate pot life (45–90 min at 25°C) |
| Storage Stability | 12 months unopened under dry, cool conditions (≤25°C) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
