High reactivity with epoxy resins enabling rapid ambient or low-temperature cure profiles.
Excellent chemical resistance post-cure, particularly to solvents, acids, and alkalis.
Low viscosity and good compatibility for easy incorporation into multi-component epoxy systems.
Reduced exotherm during curing — enhances safety and minimizes thermal stress in thick-section applications.
Halogen-free formulation supporting sustainability goals and regulatory compliance (e.g., RoHS, REACH).
High-performance industrial floor coatings requiring fast return-to-service.
Electrical encapsulation and potting compounds for transformers and electronic modules.
Marine and offshore protective coatings for steel substrates exposed to aggressive environments.
Wind turbine blade bonding adhesives and structural composites.
Automotive under-hood components requiring thermal stability and mechanical resilience.
| Chemical Type | Modified polyamine curing agent |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Primary Applications | Epoxy resin curing for coatings, adhesives, and composites |
| Key Features | Ambient-curable, low-VOC, halogen-free |
| Benefits | Fast handling strength development, excellent adhesion to metals and concrete |
| Storage Stability | ≥12 months at 20–25 °C in sealed original container |
| Recommended Epoxy Equivalent Ratio (AHEW:EEW) | 1.0–1.2:1.0 (based on DGEBA-type resins) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China