Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Ancamine 2777 Curing Agent

Evonik Ancamine 2777 is a low-viscosity, aliphatic polyamine curing agent from Evonik’s Ancamine series, designed for epoxy resins. It delivers fast ambient-cure performance, excellent flexibility, and superior chemical resistance—ideal for coatings, adhesives, and composites requiring toughness and durability without heat activation.
  • evonik ancamine 2777 curing agent_84f1aa82
  • evonik ancamine 2777 curing agent_84f1aa82

Features Of Evonik Ancamine 2777 Curing Agent

  1. Fast-reacting aliphatic amine curing agent for ambient- and low-temperature epoxy systems.

  2. Excellent flexibility and impact resistance in cured epoxy formulations.

  3. Low viscosity enables easy handling, good mixing, and improved filler incorporation.

  4. Reduced volatility and lower skin irritation potential compared to conventional DETA-based amines.

  5. Provides good chemical resistance and adhesion to diverse substrates including metals and concrete.

Typical Applications Of Evonik Ancamine 2777 Curing Agent

  1. Industrial maintenance coatings for steel structures and offshore equipment.

  2. Flooring systems requiring rapid return-to-service under ambient conditions.

  3. Adhesives and structural bonding compounds in transportation and wind energy sectors.

  4. Repair mortars and grouts for civil engineering and infrastructure rehabilitation.

  5. Electrical encapsulation and potting compounds demanding toughness and thermal stability.

Specifications Of Evonik Ancamine 2777 Curing Agent

Chemical TypeAliphatic polyamine adduct
Product FormLiquid
AppearancePale yellow to amber clear liquid
Primary ApplicationsAmbient-cure epoxy coatings, adhesives, mortars, and composites
Key FeaturesLow volatility, flexible cure profile, good compatibility with standard epoxy resins
BenefitsImproved worker safety, reduced VOC contribution, enhanced mechanical toughness
Storage StabilityAt least 12 months in original unopened container at 20 °C
ReactivityReacts readily with DGEBA-type epoxy resins at 10–30 °C


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