High reactivity with epoxy resins enabling rapid ambient or low-temperature cure profiles.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy systems.
Low viscosity for easy handling, metering, and homogeneous mixing without solvent addition.
Good chemical resistance in cured formulations, particularly against alkalis and polar solvents.
Halogen-free formulation supporting environmentally responsible manufacturing and regulatory compliance (e.g., RoHS, REACH).
Electrical encapsulation and potting compounds for power electronics and LED modules.
Structural adhesives in automotive and rail interior bonding applications.
Coating systems for corrosion protection on metal substrates in industrial maintenance.
Composite matrix resins for pultrusion and filament winding of fiber-reinforced profiles.
3D printing support materials and castable tooling resins requiring dimensional stability.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Viscosity (25°C) | 400–600 mPa·s |
| Density (20°C) | 0.98–1.02 g/cm³ |
| Amine Value | 220–250 mg KOH/g |
| Primary Applications | Epoxy resin curing for coatings, adhesives, composites, and encapsulants |
| Key Features | Fast ambient cure, low exotherm, halogen-free, low odor |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China