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Fast-reacting aliphatic amine-based curing agent for room-temperature and elevated-temperature epoxy systems.
Excellent compatibility with standard liquid and solid bisphenol-A and bisphenol-F epoxy resins.
Delivers high crosslink density, resulting in superior chemical resistance and mechanical strength in cured films.
Low viscosity enables easy handling, precise metering, and uniform mixing without solvent dilution.
Low volatility and reduced skin sensitization potential compared to conventional DETA-type amines.
Industrial protective coatings for steel structures, pipelines, and marine equipment.
Electrical insulation systems including potting compounds and encapsulants for transformers and PCBs.
High-performance adhesives for automotive composites and aerospace bonding applications.
Flooring systems requiring rapid turnaround, such as epoxy terrazzo and self-leveling industrial floors.
Repair mortars and grouts for concrete rehabilitation in infrastructure and civil engineering projects.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Viscosity (25°C) | 180–240 mPa·s |
| Active Hydrogen Equivalent Weight | 82–88 g/eq |
| Density (25°C) | 0.92–0.94 g/cm³ |
| Amine Value | 620–660 mg KOH/g |
| Flash Point (PMCC) | ≥95°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
