Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Sunmide 315 Polyamide Curing Agent

Evonik Sunmide 315 is a high-performance polyamide curing agent from Evonik’s Sunmide series, designed for epoxy resin systems requiring flexibility, toughness and excellent chemical resistance. It delivers low viscosity, extended pot life and superior adhesion to damp or contaminated substrates—ideal for industrial coatings, flooring and repair mortars.
  • evonik sunmide 315 polyamide curing agent_db72fe0b
  • evonik sunmide 315 polyamide curing agent_db72fe0b

Features Of Evonik Sunmide 315 Polyamide Curing Agent

  1. Low-viscosity liquid polyamide offering excellent compatibility with epoxy resins.

  2. Enables room-temperature curing with good pot life and extended working time.

  3. Delivers high flexibility, impact resistance, and adhesion to diverse substrates including metals and concrete.

  4. Provides superior chemical resistance to alkalis, solvents, and mild acids in cured systems.

  5. Free of volatile organic compounds (VOC-free), supporting sustainable coating formulations.

Typical Applications Of Evonik Sunmide 315 Polyamide Curing Agent

  1. Industrial maintenance coatings for steel structures and offshore equipment.

  2. Concrete floor coatings requiring flexibility and abrasion resistance.

  3. Marine and protective coatings for ballast tanks and cargo holds.

  4. Electrical insulation systems for castings and encapsulations.

  5. Adhesives and composite matrices in low-heat-cure applications.

Specifications Of Evonik Sunmide 315 Polyamide Curing Agent

Chemical TypePolyamide adduct
Product FormLiquid
AppearanceAmber to light brown transparent liquid
Amine Value320–360 mg KOH/g
Viscosity (25 °C)800–1,200 mPa·s
Density (20 °C)0.94–0.97 g/cm³
Primary ApplicationsEpoxy-based protective coatings, adhesives, and composites
Key FeaturesRoom-temperature cure, flexible film formation, VOC-free


Evonik Sunmide 315 Polyamide Curing Agent – Frequently Asked Questions (FAQ)

Q1: What types of epoxy resins is Sunmide 315 compatible with?

A: Sunmide 315 is designed for use with standard liquid and solid bisphenol-A and bisphenol-F based epoxy resins, as well as many novolac and cycloaliphatic epoxies. Compatibility should be confirmed experimentally for specialty or modified epoxy systems.


Q2: How does Sunmide 315 compare to conventional polyamide curing agents in terms of pot life and cure speed?

A: Sunmide 315 offers an extended working time at ambient temperatures compared to many fast-reacting aliphatic amines, while still enabling efficient room-temperature or mild-heat cure profiles. Its reactivity is balanced to support good handling properties without sacrificing final crosslink density.


Q3: Is Sunmide 315 suitable for coatings requiring low VOC and high surface quality?

A: Yes — Sunmide 315 is a low-viscosity, solvent-free polyamide adduct that contributes to low-VOC formulations. Its controlled reactivity and compatibility support excellent film formation, minimal surface defects, and good intercoat adhesion in high-performance protective and decorative coatings.


Q4: What are the key storage and handling recommendations for Sunmide 315?

A: Store in original sealed containers in a cool, dry place away from moisture, heat sources, and direct sunlight. Once opened, minimize exposure to ambient humidity and ensure containers are tightly closed. Use appropriate personal protective equipment (PPE) including gloves and eye protection during handling.



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