Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Sunmide 315 Polyamide Curing Agent

Evonik Sunmide 315 is a high-performance polyamide curing agent from Evonik’s Sunmide series, designed for epoxy resin systems requiring flexibility, toughness and excellent chemical resistance. It delivers low viscosity, extended pot life and superior adhesion to damp or contaminated substrates—ideal for industrial coatings, flooring and repair mortars.
  • evonik sunmide 315 polyamide curing agent_db72fe0b
  • evonik sunmide 315 polyamide curing agent_db72fe0b

Features Of Evonik Sunmide 315 Polyamide Curing Agent

  1. Low-viscosity liquid polyamide offering excellent compatibility with epoxy resins.

  2. Enables room-temperature curing with good pot life and extended working time.

  3. Delivers high flexibility, impact resistance, and adhesion to diverse substrates including metals and concrete.

  4. Provides superior chemical resistance to alkalis, solvents, and mild acids in cured systems.

  5. Free of volatile organic compounds (VOC-free), supporting sustainable coating formulations.

Typical Applications Of Evonik Sunmide 315 Polyamide Curing Agent

  1. Industrial maintenance coatings for steel structures and offshore equipment.

  2. Concrete floor coatings requiring flexibility and abrasion resistance.

  3. Marine and protective coatings for ballast tanks and cargo holds.

  4. Electrical insulation systems for castings and encapsulations.

  5. Adhesives and composite matrices in low-heat-cure applications.

Specifications Of Evonik Sunmide 315 Polyamide Curing Agent

Chemical TypePolyamide adduct
Product FormLiquid
AppearanceAmber to light brown transparent liquid
Amine Value320–360 mg KOH/g
Viscosity (25 °C)800–1,200 mPa·s
Density (20 °C)0.94–0.97 g/cm³
Primary ApplicationsEpoxy-based protective coatings, adhesives, and composites
Key FeaturesRoom-temperature cure, flexible film formation, VOC-free


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *