Fast-reacting aliphatic amine adduct offering excellent low-temperature cure performance.
Low viscosity and favorable pot life for improved processing and extended working time.
Provides high crosslink density, resulting in superior chemical resistance and mechanical strength.
Low volatility and reduced skin irritation potential compared to conventional primary amines.
Compatible with standard epoxy resins (e.g., DGEBA) without requiring solvents or diluents.
High-performance industrial flooring systems requiring rapid return-to-service.
Structural adhesives for automotive and aerospace composite bonding.
Electrical encapsulation and potting compounds demanding thermal stability and dielectric integrity.
Protective coatings for concrete, steel, and marine infrastructure.
Wind turbine blade bonding and repair formulations.
| Chemical Type | Aliphatic amine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Amine Value | 230–250 mg KOH/g |
| Viscosity (25 °C) | 200–400 mPa·s |
| Density (20 °C) | 0.92–0.95 g/cm³ |
| Flash Point (PMCC) | ≥ 100 °C |
| Primary Applications | Epoxy resin curing for coatings, adhesives, composites, and flooring |
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E-mail: wangxingqiang@ericwchem.com
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