Fast-reacting aliphatic amine-based curing agent for ambient and elevated temperature cure profiles.
Excellent chemical resistance—particularly to hydrolysis, solvents, and alkaline environments.
Low viscosity enables easy metering, mixing, and processing in automated dispensing systems.
Low volatility and low odor support safer handling and improved workplace air quality.
Enables high glass transition temperature (Tg) and superior mechanical performance in cured epoxy systems.
High-performance industrial flooring and protective coatings.
Structural adhesives for aerospace and transportation composites.
Epoxy grouts and mortars used in heavy-duty civil engineering infrastructure.
Electrical encapsulation and potting compounds requiring thermal stability and dielectric integrity.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Clear to pale yellow, homogeneous liquid |
| Viscosity (25°C) | 150–300 mPa·s |
| Density (25°C) | 0.92–0.96 g/cm³ |
| Amine Value | 280–320 mg KOH/g |
| Primary Applications | Epoxy resin curing for coatings, adhesives, and composites |
| Key Features | Fast cure, low odor, hydrolytic stability, excellent adhesion |
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E-mail: wangxingqiang@ericwchem.com
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