High-reactivity aliphatic amine-based curing agent for rapid room-temperature cure of epoxy resins.
Low viscosity and excellent compatibility with standard bisphenol-A and bisphenol-F epoxy systems.
Superior mechanical properties in cured films, including high hardness, abrasion resistance, and chemical resistance.
Low volatility and reduced amine odor versus conventional aliphatic amines—enhancing workplace safety and handling comfort.
Good pot life stability when mixed with epoxy resins at ambient temperature (typically 4–6 hours at 25°C).
High-performance industrial flooring systems requiring fast turnaround and heavy-duty service.
Electrical encapsulation and potting compounds for transformers, sensors, and power electronics.
Structural adhesives and composite matrix resins in transportation and wind energy components.
Coating formulations for corrosion protection on steel infrastructure, tanks, and pipelines.
Repair mortars and grouts demanding rapid strength development and low-temperature performance.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to light amber transparent liquid |
| Density (25°C) | ~0.92–0.94 g/cm³ |
| Viscosity (25°C) | 200–300 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Primary Applications | Epoxy resin curing for coatings, adhesives, composites, and castings |
| Key Features | Room-temperature cure, low odor, low exotherm, high toughness |
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E-mail: wangxingqiang@ericwchem.com
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