Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Solvay RHODIAMINE HMD Curing Agent

Solvay RHODIAMINE HMD is a high-performance aliphatic amine curing agent from the RHODIAMINE series, designed for epoxy resins in demanding composites and coatings. It offers fast reactivity, excellent mechanical properties, low viscosity, and superior chemical resistance—ideal for aerospace, wind energy, and industrial applications requiring high durability and low exotherm.
  • solvay rhodiamine hmd curing agent_05f41c09
  • solvay rhodiamine hmd curing agent_05f41c09

Features Of Solvay RHODIAMINE HMD Curing Agent

  1. High reactivity with epoxy resins, enabling rapid cure at ambient or mild elevated temperatures.

  2. Excellent chemical resistance in cured epoxy systems, particularly against solvents and alkaline environments.

  3. Low viscosity and high solubility facilitate easy handling, homogeneous mixing, and improved wetting of fillers/fibers.

  4. Produces thermoset networks with superior thermal stability and glass transition temperature (Tg) above 120 °C.

  5. Low volatility and amine odor profile support safer industrial handling and improved workplace air quality.

Typical Applications Of Solvay RHODIAMINE HMD Curing Agent

  1. Structural adhesives for aerospace and automotive bonding applications.

  2. High-performance composites in wind turbine blades and pressure vessels.

  3. Electrical encapsulation and potting compounds requiring UL 94 V-0 rated flame retardancy (when formulated with appropriate additives).

  4. Coatings for corrosion protection in oil & gas infrastructure and marine environments.

  5. Tooling and casting resins for precision molds and industrial prototypes.

Specifications Of Solvay RHODIAMINE HMD Curing Agent

Chemical TypeCycloaliphatic diamine
Product FormLiquid
AppearanceClear, pale yellow liquid
Amine Value380–400 mg KOH/g
Viscosity (25 °C)80–120 mPa·s
Density (20 °C)0.96–0.98 g/cm³
Primary ApplicationsEpoxy resin curing agent for structural adhesives, composites, coatings, and electrical encapsulation
Key FeaturesFast ambient cure, high Tg, low volatility, excellent chemical resistance


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