Waterborne polyamide-based curing agent for epoxy resins, enabling low-VOC and high-performance coatings.
Excellent compatibility with standard bisphenol A and bisphenol F epoxy dispersions.
Provides fast ambient-cure kinetics with good pot life (typically 4–6 hours at 23°C).
Delivers superior adhesion to steel, aluminum, and concrete substrates.
Offers excellent chemical resistance, including to alkalis, salts, and mild solvents after full cure.
Industrial maintenance coatings for structural steel and pipelines.
Waterborne epoxy primers in marine and offshore protective systems.
Concrete floor coatings requiring low-odor, fast-turnaround application.
High-solids and water-reducible anti-corrosive topcoats for infrastructure projects.
| Chemical Type | Waterborne polyamide adduct |
| Product Form | Liquid dispersion |
| Appearance | Opaque white to off-white liquid |
| pH (10% aqueous solution) | 7.5 – 8.5 |
| Solids Content (wt%) | 48 – 52 |
| Viscosity (mPa·s, Brookfield RVT, #3 spindle, 20 rpm, 23°C) | 1,200 – 2,500 |
| Density (g/cm³, 20°C) | 1.02 – 1.06 |
| Primary Applications | Epoxy primer and mid-coat systems for corrosion protection |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China