High reactivity with epoxy resins, enabling rapid room-temperature or low-temperature curing.
Excellent chemical resistance post-cure, particularly against solvents, acids, and alkalis.
Low viscosity and good compatibility, facilitating homogeneous mixing and improved processability.
Low volatility and negligible amine blush formation, supporting high-gloss surface finish and adhesion integrity.
Non-halogenated formulation aligned with evolving environmental and regulatory requirements (e.g., RoHS, REACH).
Electronics encapsulation and potting compounds for PCB protection and thermal management.
High-performance structural adhesives in automotive and aerospace composite bonding.
Protective coatings for metal substrates in industrial and marine environments.
Electrical insulation systems in transformers, motors, and generators.
Advanced composites requiring low-exotherm cure profiles and dimensional stability.
| Chemical Type | Amine-functionalized aliphatic polyether adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to colorless transparent liquid |
| Viscosity (25°C) | 800–1,200 mPa·s |
| Density (25°C) | 1.02–1.06 g/cm³ |
| Amine Value | 280–320 mg KOH/g |
| Reactivity Profile | Medium-to-high (compatible with DGEBA and modified epoxy resins) |
| Storage Stability | ≥12 months at 5–30°C in sealed original container |
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