Fast-reacting aliphatic amine-based curing agent designed for ambient and elevated temperature epoxy systems.
Delivers excellent mechanical properties, including high hardness and abrasion resistance in cured films.
Low viscosity enables easy handling, precise metering, and superior compatibility with standard epoxy resins.
Low volatility and reduced amine odor enhance workplace safety and operator comfort during processing.
Provides good chemical resistance—particularly to alkalis, solvents, and mild acids—in fully cured formulations.
High-performance industrial flooring systems for warehouses, manufacturing facilities, and cleanrooms.
Structural adhesives used in transportation and wind energy composite bonding.
Electrical encapsulation and potting compounds requiring rapid turnaround and thermal stability.
Coatings for metal substrates in heavy-duty maintenance and infrastructure protection.
Repair mortars and grouts where fast strength development and low-temperature cure are critical.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Primary Applications | Epoxy resin curing for coatings, adhesives, and composites |
| Key Features | Ambient-cure capable, low odor, low viscosity, high reactivity |
| Benefits | Reduced cycle time, improved worker safety, enhanced cured-film toughness |
| Storage Stability | ≥12 months at 20–25°C in sealed original container |
| Reactivity Profile | Medium-to-fast (vs. standard DETA or TETA) |
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E-mail: wangxingqiang@ericwchem.com
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