Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Covestro Desmodur N3300 Curing Agent

Covestro Desmodur N3300 is a high-performance aliphatic polyisocyanate curing agent from the Desmodur N series, designed for two-component polyurethane coatings. It offers excellent UV stability, low viscosity, and fast curing at room temperature. Widely used in automotive clearcoats, industrial finishes, and premium wood coatings where gloss retention and weather resistance are critical.
  • covestro desmodur n3300 curing agent_e77639f4
  • covestro desmodur n3300 curing agent_e77639f4

Features Of Covestro Desmodur N3300 Curing Agent

  1. Aliphatic polyisocyanate based on hexamethylene diisocyanate (HDI) trimer chemistry.

  2. Low volatility and excellent hydrolytic stability for improved handling and shelf life.

  3. Provides outstanding UV resistance and long-term gloss retention in coated surfaces.

  4. Enables fast curing at ambient or elevated temperatures with balanced pot life.

  5. Compatible with a broad range of OH-functional resins including polyesters, acrylics, and polyethers.

Typical Applications Of Covestro Desmodur N3300 Curing Agent

  1. High-performance automotive clearcoats and basecoats.

  2. Industrial maintenance coatings for metal and plastic substrates.

  3. Premium wood coatings requiring durability and clarity.

  4. Plastic coatings for exterior automotive trim and electronics housings.

  5. Two-component (2K) polyurethane topcoats for architectural and transportation applications.

Specifications Of Covestro Desmodur N3300 Curing Agent

Chemical TypeAliphatic HDI-based isocyanurate trimer
Product FormLiquid
AppearanceColorless to pale yellow transparent liquid
NCO Content (wt %)15.5 – 16.5
Viscosity at 25 °C (mPa·s)2,500 – 4,000
Density at 20 °C (g/cm³)1.18 – 1.22
Flash Point (PMCC, °C)145 – 155
SolventAcetate ester blend (e.g., butyl acetate)


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *