Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Allnex EBECRYL LED03 Crosslinking Agent

Allnex EBECRYL LED03 is a low-viscosity, trifunctional acrylate crosslinking agent from the EBECRYL® LED series, engineered for rapid LED-UV curing in coatings, inks, and adhesives. It delivers excellent surface hardness, chemical resistance, and compatibility with common photoinitiators—ideal for high-speed, energy-efficient industrial applications.
  • allnex ebecryl led03 crosslinking agent_d243575a
  • allnex ebecryl led03 crosslinking agent_d243575a

Features Of Allnex EBECRYL LED03 Crosslinking Agent

  1. Optimized for rapid, low-energy LED-UV curing systems with high reactivity at 365–405 nm wavelengths.

  2. Low volatility and minimal odor, supporting improved workplace safety and compliance with VOC regulations.

  3. Excellent compatibility with acrylate-based resins, enabling formulation flexibility in 100% solids systems.

  4. Delivers superior surface hardness and chemical resistance in final cured films without post-bake.

  5. Reduced oxygen inhibition sensitivity compared to conventional mono- and difunctional acrylates.

Typical Applications Of Allnex EBECRYL LED03 Crosslinking Agent

  1. LED-curable wood coatings for furniture and flooring.

  2. Industrial plastic coatings for automotive interior trim and consumer electronics housings.

  3. Overprint varnishes and functional topcoats for packaging substrates including PET and PVC.

  4. Screen-printed and inkjet inks requiring instant through-cure on heat-sensitive substrates.

  5. Adhesives and laminating formulations demanding fast line speeds and low energy input.

Specifications Of Allnex EBECRYL LED03 Crosslinking Agent

Chemical TypeUrethane acrylate oligomer (trifunctional)
Product FormLiquid
AppearancePale yellow, clear liquid
Viscosity (25 °C)8,000–12,000 mPa·s
Refractive Index (25 °C)1.490–1.495
Acid Number (mg KOH/g)< 2
Primary ApplicationsLED-UV curable coatings, inks, and adhesives
Key FeaturesFast cure speed, low shrinkage, high crosslink density


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