Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Ancamide 221-X70 Curing Agent

Evonik Ancamide 221-X70 is a low-viscosity, aliphatic polyamine curing agent from Evonik’s Ancamide® series, designed for epoxy resins. It delivers fast cure at ambient temperatures, excellent flexibility, chemical resistance, and low exotherm—ideal for coatings, adhesives, and composites requiring toughness and durability without heat activation.
  • evonik ancamide 221 x70 curing agent_04d280e7
  • evonik ancamide 221 x70 curing agent_04d280e7

Features Of Evonik Ancamide 221-X70 Curing Agent

  1. Fast-reacting aliphatic polyamine curing agent for rapid ambient-cure epoxy systems.

  2. Low viscosity enables easy handling, metering, and thorough mixing with epoxy resins.

  3. Provides excellent flexibility and impact resistance in cured epoxy coatings and adhesives.

  4. Good chemical resistance—particularly to water, salts, and mild alkalis—after full cure.

  5. Low volatility and non-sensitizing formulation supports safer industrial handling (in accordance with Evonik’s safety guidance).

Typical Applications Of Evonik Ancamide 221-X70 Curing Agent

  1. Industrial maintenance coatings for steel structures and concrete substrates.

  2. High-performance epoxy adhesives for metal-to-metal and composite bonding.

  3. Repair mortars and grouts requiring rapid strength development at ambient temperature.

  4. Electrical encapsulation compounds where low exotherm and dimensional stability are critical.

  5. Marine and offshore protective coatings subject to immersion and cyclic wet/dry conditions.

Specifications Of Evonik Ancamide 221-X70 Curing Agent

Chemical TypeAliphatic polyamine adduct
Product FormLiquid
AppearancePale yellow to amber clear liquid
Primary ApplicationsAmbient-cure epoxy coatings, adhesives, mortars, and encapsulants
Key FeaturesFast ambient cure, low viscosity, flexible cured film, low odor
BenefitsReduced processing time, improved operator safety, enhanced toughness and adhesion
Storage StabilityAt least 12 months in original sealed container at 15–25 °C
CompatibilityCompatible with standard liquid bisphenol-A and bisphenol-F epoxy resins


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