High reactivity with epoxy resins, enabling rapid gelation and reduced cycle times.
Excellent low-temperature curing performance down to 5°C without external heat input.
Low viscosity (200–400 mPa·s at 25°C) for easy metering, mixing, and deep-section penetration.
Superior chemical resistance in cured systems, particularly against alkalis and mild solvents.
Non-halogenated formulation compliant with RoHS and REACH regulatory requirements.
Electrical potting and encapsulation of sensors, transformers, and PCB assemblies.
Structural adhesive formulations for automotive composite bonding and under-hood components.
Wind turbine blade root joint adhesives requiring fast ambient-cure capability.
Repair mortars and grouts for industrial concrete and metal substrates.
| Chemical Type | Aliphatic amine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (25°C) | 0.92–0.96 g/cm³ |
| Viscosity (25°C) | 200–400 mPa·s |
| Amine Value | 220–250 mg KOH/g |
| Primary Applications | Epoxy-based potting, encapsulation, adhesives, and repair compounds |
| Key Features | Ambient-cure, low odor, non-crystallizing, moisture-tolerant |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China