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Low-viscosity polyamide curing agent enabling excellent flow and wetting of substrates.
Provides balanced pot life and rapid room-temperature cure for epoxy systems.
Delivers high flexibility and impact resistance in cured epoxy coatings and adhesives.
Offers good chemical resistance, particularly to alkalis and solvents.
Compatible with standard bisphenol-A and bisphenol-F epoxy resins.
Industrial maintenance coatings for steel and concrete infrastructure.
High-performance epoxy flooring systems in commercial and manufacturing facilities.
Structural adhesives for metal-to-metal and composite bonding.
Electrical encapsulants and insulating varnishes requiring toughness and moisture resistance.
Marine and offshore protective coatings exposed to humid and saline environments.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Amber to light brown viscous liquid |
| Amine Value (mg KOH/g) | 320–360 |
| Viscosity @ 25°C (mPa·s) | 1,800–2,500 |
| Specific Gravity @ 25°C | 0.97–1.01 |
| Primary Applications | Epoxy coatings, adhesives, and encapsulants |
| Key Features | Room-temperature cure, flexibility, chemical resistance |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
