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Low-viscosity polyamide curing agent enabling excellent flow and wetting of substrates.
Provides balanced pot life and rapid room-temperature cure for epoxy systems.
Delivers high flexibility and impact resistance in cured epoxy coatings and adhesives.
Offers good chemical resistance, particularly to alkalis and solvents.
Compatible with standard bisphenol-A and bisphenol-F epoxy resins.
Industrial maintenance coatings for steel and concrete infrastructure.
High-performance epoxy flooring systems in commercial and manufacturing facilities.
Structural adhesives for metal-to-metal and composite bonding.
Electrical encapsulants and insulating varnishes requiring toughness and moisture resistance.
Marine and offshore protective coatings exposed to humid and saline environments.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Amber to light brown viscous liquid |
| Amine Value (mg KOH/g) | 320–360 |
| Viscosity @ 25°C (mPa·s) | 1,800–2,500 |
| Specific Gravity @ 25°C | 0.97–1.01 |
| Primary Applications | Epoxy coatings, adhesives, and encapsulants |
| Key Features | Room-temperature cure, flexibility, chemical resistance |
Q1: What is the primary function of EPIKURE 3155 in epoxy systems?
A: EPIKURE 3155 is a polyamide-based curing agent designed to react with epoxy resins, enabling crosslinking at ambient or slightly elevated temperatures. It delivers balanced pot life, mechanical toughness, and chemical resistance—particularly suited for protective coatings and industrial adhesives.
Q2: Is EPIKURE 3155 compatible with standard liquid epoxy resins such as DGEBA?
A: Yes, EPIKURE 3155 is broadly compatible with common bisphenol-A based liquid epoxy resins (e.g., EPON 828, D.E.R. 331) and many solid epoxy resins. Optimal performance typically requires formulation adjustment to account for resin functionality, molecular weight, and desired cure profile.
Q3: How does humidity affect the curing performance of EPIKURE 3155?
A: As a polyamide curing agent, EPIKURE 3155 exhibits good tolerance to moderate ambient humidity during application and cure. However, prolonged exposure to high relative humidity (>85%) may delay surface dryness or affect final film integrity—especially in thick-film applications—so controlled environmental conditions are recommended for critical performance requirements.
Q4: Can EPIKURE 3155 be used in food-contact or potable water applications?
A: EPIKURE 3155 is not pre-qualified for direct food-contact or potable water applications. Its suitability for such uses depends on full system formulation, final cured film testing, and compliance with applicable regulatory frameworks—formulators must conduct appropriate migration and safety assessments before claiming regulatory acceptance.
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E-mail: wangxingqiang@ericwchem.com
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