Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Kumho Mitsui LL Curing Agent

Kumho Mitsui LL Curing Agent is a high-performance aliphatic amine-based epoxy hardener from the Kumho Mitsui Chemicals’ LL Series, engineered for low viscosity, extended pot life, and excellent chemical resistance—ideal for industrial coatings, composites, and adhesive applications requiring rapid ambient-cure performance and superior mechanical properties.
  • kumho mitsui ll curing agent_11c5f49e
  • kumho mitsui ll curing agent_11c5f49e

Features Of Kumho Mitsui LL Curing Agent

  1. High reactivity with epoxy resins, enabling rapid gelation and reduced cycle times.

  2. Excellent low-temperature curing performance, effective even at 5–10 °C ambient conditions.

  3. Low volatility and minimal odor, supporting safer handling and improved workplace air quality.

  4. Good compatibility with standard bisphenol-A and bisphenol-F epoxy systems.

  5. Enhanced final-cure mechanical properties, including superior flexural strength and impact resistance.

Typical Applications Of Kumho Mitsui LL Curing Agent

  1. Electrical insulation encapsulants for transformers and reactors.

  2. Structural adhesives in automotive composite bonding.

  3. Wind turbine blade root jointing and repair formulations.

  4. High-performance flooring and grouting systems for industrial facilities.

  5. Marine-grade protective coatings requiring fast turnaround in humid environments.

Specifications Of Kumho Mitsui LL Curing Agent

Chemical TypeAmine-based aliphatic curing agent
Product FormLiquid
AppearancePale yellow to amber clear liquid
Density (25 °C)0.92–0.96 g/cm³
Viscosity (25 °C)200–400 mPa·s
Amine Value380–420 mg KOH/g
Primary ApplicationsEpoxy resin curing for structural, electrical, and protective applications
Key FeaturesLow-temperature cure, low volatility, high reactivity, excellent compatibility


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *