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Low-viscosity liquid formulation enabling excellent processability and easy handling in standard epoxy systems.
Fast reactivity at ambient temperature, supporting rapid gelation and reduced cycle times in manufacturing.
Excellent compatibility with bisphenol-A and bisphenol-F epoxy resins without phase separation.
Delivers high glass transition temperature (Tg) and superior mechanical strength in cured networks.
Low volatility and low odor profile, contributing to improved workplace safety and compliance with industrial hygiene standards.
Electrical encapsulation and potting compounds for power electronics and LED modules.
High-performance adhesives for automotive structural bonding and composite assembly.
Wind turbine blade matrix resins requiring fast-cure capability and thermal stability.
Coatings for corrosion protection in offshore and industrial infrastructure.
Tooling and casting resins for rapid prototyping and mold-making applications.
| Chemical Type | Aliphatic amine adduct |
| Product Form | Liquid |
| Appearance | Clear, pale yellow liquid |
| Density (20 °C) | Approx. 0.94–0.96 g/cm³ |
| Viscosity (25 °C) | Approx. 250–400 mPa·s |
| Amine Value | 240–260 mg KOH/g |
| Primary Applications | Fast-cure epoxy systems for composites, adhesives, and encapsulants |
| Key Features | Low viscosity, ambient reactivity, high Tg, low volatility |
Q1: What is the primary function of LH-210 in epoxy systems?
A: LH-210 is a latent, amine-based curing agent designed to enable controlled epoxy crosslinking at elevated temperatures. It provides extended pot life at ambient conditions while delivering rapid and thorough cure upon thermal activation, making it especially suitable for powder coatings, prepregs, and thermoset composites.
Q2: Is LH-210 compatible with standard bisphenol-A and bisphenol-F epoxy resins?
A: Yes, LH-210 demonstrates broad compatibility with conventional liquid and solid diglycidyl ether of bisphenol-A (DGEBA) and bisphenol-F (DGEBF) resins, as well as novolac epoxies. Compatibility and reactivity may vary depending on resin molecular weight and functionality, so formulation optimization is recommended.
Q3: How should LH-210 be incorporated into an epoxy formulation?
A: LH-210 is typically blended directly into the epoxy resin under moderate shear and elevated temperature (e.g., 60–80 °C) to ensure homogeneous dispersion. It is important to avoid prolonged exposure to moisture and to store the formulated mixture under dry, cool conditions prior to curing.
Q4: Does LH-210 support high-gloss, low-haze finishes in coating applications?
A: Yes—when properly formulated and cured, LH-210 contributes to excellent film clarity, high surface gloss, and minimal haze, particularly in powder coating and castable epoxy systems where aesthetic performance and optical uniformity are critical.
Q5: What safety and handling precautions apply to LH-210?
A: As with other amine-based curing agents, LH-210 may cause skin and respiratory sensitization. Users should wear appropriate PPE—including nitrile gloves, safety goggles, and respiratory protection when handling powders—and ensure adequate ventilation during processing. Refer to the current Safety Data Sheet (SDS) for detailed occupational hygiene guidance.
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