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Low-viscosity liquid formulation enabling excellent processability and easy handling in standard epoxy systems.
Fast reactivity at ambient temperature, supporting rapid gelation and reduced cycle times in manufacturing.
Excellent compatibility with bisphenol-A and bisphenol-F epoxy resins without phase separation.
Delivers high glass transition temperature (Tg) and superior mechanical strength in cured networks.
Low volatility and low odor profile, contributing to improved workplace safety and compliance with industrial hygiene standards.
Electrical encapsulation and potting compounds for power electronics and LED modules.
High-performance adhesives for automotive structural bonding and composite assembly.
Wind turbine blade matrix resins requiring fast-cure capability and thermal stability.
Coatings for corrosion protection in offshore and industrial infrastructure.
Tooling and casting resins for rapid prototyping and mold-making applications.
| Chemical Type | Aliphatic amine adduct |
| Product Form | Liquid |
| Appearance | Clear, pale yellow liquid |
| Density (20 °C) | Approx. 0.94–0.96 g/cm³ |
| Viscosity (25 °C) | Approx. 250–400 mPa·s |
| Amine Value | 240–260 mg KOH/g |
| Primary Applications | Fast-cure epoxy systems for composites, adhesives, and encapsulants |
| Key Features | Low viscosity, ambient reactivity, high Tg, low volatility |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
