Faster ambient-cure kinetics versus conventional aliphatic amines, enabling reduced demolding times.
Low viscosity and excellent compatibility with standard epoxy resins, supporting high filler loading and easy processing.
Low volatility and low skin sensitization potential — compliant with REACH and OSHA handling guidelines.
Good chemical resistance in cured systems, particularly against alkalis and solvents.
Halogen-free formulation supporting sustainability targets and regulatory compliance in electronics and transport sectors.
Structural adhesives for automotive lightweight assemblies.
Electrical encapsulants and potting compounds for power electronics.
High-performance flooring and industrial coatings requiring rapid return-to-service.
Wind turbine blade bonding and repair systems.
Composite tooling matrices for aerospace and marine applications.
| Chemical Type | Modified aliphatic amine |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Primary Applications | Epoxy resin curing agent for structural adhesives, composites, and encapsulants |
| Key Features | Ambient-curing, low-viscosity, halogen-free, low-sensitization |
| Benefits | Improved productivity, enhanced worker safety, broad formulation flexibility |
| Storage Stability | ≥12 months at 20–25 °C in unopened original container |
| Reactivity Profile | Medium reactivity (faster than DETA, slower than TETA) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China