High reactivity with epoxy resins, enabling rapid gelation and short demolding cycles.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy systems.
Low viscosity at room temperature for easy handling, metering, and homogeneous mixing.
Good thermal stability with onset decomposition above 200 °C (TGA, air atmosphere).
Halogen-free formulation supporting UL 94 V-0 compliant end-product requirements.
Electrical insulation encapsulants for power modules and IGBTs.
Structural adhesives in automotive electronics and battery pack assembly.
Encapsulation of high-voltage sensors and renewable energy inverters.
Thermosetting composites for aerospace-grade potting and bonding.
LED packaging compounds requiring low stress and high dielectric strength.
| Chemical Type | Aromatic amine-based latent curing agent |
| Product Form | Free-flowing pale yellow to amber solid granules |
| Appearance | Homogeneous granular powder, no visible lumps or discoloration |
| Primary Applications | Epoxy encapsulation, potting, and structural bonding |
| Key Features | Latent activation, low exotherm, halogen-free |
| Benefits | Extended pot life at ambient temperature, fast cure at elevated temperatures (130–150 °C) |
| Storage Stability | ≥12 months at ≤25 °C in sealed original packaging |
| Handling Precaution | Use in well-ventilated areas; avoid inhalation of dust and skin contact |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China