Highly reactive aliphatic amine-based curing agent for fast ambient-cure epoxy systems.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Low viscosity enables easy handling, precise metering, and good wetting of fillers and reinforcements.
Provides superior mechanical properties including high hardness, chemical resistance, and adhesion to diverse substrates.
Low volatility and non-sensitizing formulation supports safer industrial handling per current EHS guidelines.
Structural adhesives for automotive and transportation assembly.
High-performance flooring and coating systems in industrial facilities.
Electrical encapsulation and potting compounds for power electronics.
Composite repair kits and wind turbine blade bonding formulations.
Precision tooling and mold-making materials requiring dimensional stability.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Clear to pale yellow, homogeneous liquid |
| Viscosity (25 °C) | Approx. 300–500 mPa·s |
| Density (20 °C) | Approx. 0.92–0.95 g/cm³ |
| Amine Value | Approx. 380–420 mg KOH/g |
| Primary Applications | Ambient-cure structural adhesives, industrial coatings, electrical encapsulants |
| Key Features | Fast reactivity, low exotherm, excellent substrate adhesion, low skin sensitization potential |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China