Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Crelan NW5 Curing Agent

Evonik Crelan NW5 is a low-viscosity aliphatic polyamine curing agent for epoxy resins, offering fast ambient-cure performance, excellent chemical resistance and superior surface hardness. Designed for high-performance coatings and adhesives, it delivers low fogging, good compatibility and reduced amine blush—ideal for industrial maintenance and protective applications where durability and efficiency matter.
  • evonik crelan nw5 curing agent_d2dc5c2c
  • evonik crelan nw5 curing agent_d2dc5c2c

Features Of Evonik Crelan NW5 Curing Agent

  1. Aliphatic polyamine-based curing agent offering low viscosity and excellent compatibility with epoxy resins.

  2. Enables fast ambient-cure performance while maintaining extended pot life for practical processing.

  3. Delivers superior chemical resistance, particularly to alkalis and solvents, in cured epoxy systems.

  4. Provides outstanding adhesion to concrete, steel, and other industrial substrates without primer requirement.

  5. Low volatility and non-hazardous classification support safer handling and compliance with VOC-restricted environments.

Typical Applications Of Evonik Crelan NW5 Curing Agent

  1. High-performance epoxy flooring systems for industrial plants and cleanrooms.

  2. Concrete repair mortars and structural strengthening composites.

  3. Marine and offshore protective coatings requiring corrosion resistance.

  4. Electrical encapsulation and insulating varnishes for power equipment.

  5. Adhesives and grouts in civil engineering and infrastructure projects.

Specifications Of Evonik Crelan NW5 Curing Agent

Chemical TypeAliphatic polyamine adduct
Product FormLiquid
AppearancePale yellow to amber transparent liquid
Density (20 °C)Approx. 0.94–0.97 g/cm³
Viscosity (25 °C)Approx. 150–300 mPa·s
Amine ValueApprox. 380–420 mg KOH/g
Primary ApplicationsAmbient-cure epoxy coatings, mortars, adhesives, and composites
Key FeaturesLow viscosity, fast cure, excellent substrate adhesion, low volatility


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