Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik IPDA Diamine Curing Agent

Evonik IPDA Diamine Curing Agent is a high-performance aliphatic amine hardener from Evonik’s Vestamin® series, specifically Vestamin IPDA. It delivers fast reactivity, excellent chemical resistance, and low viscosity for epoxy resin systems in coatings, adhesives, and composites—ideal for demanding industrial applications requiring toughness and durability.
  • evonik ipda diamine curing agent_9559ce08
  • evonik ipda diamine curing agent_9559ce08

Features Of Evonik IPDA Diamine Curing Agent

  1. Fast-reacting aliphatic diamine offering short gel times and rapid development of mechanical properties.

  2. Excellent low-temperature reactivity, enabling efficient curing even at ambient or sub-ambient conditions.

  3. Provides superior chemical resistance and thermal stability in cured epoxy systems.

  4. Low viscosity and high amine hydrogen equivalent weight support easy handling and formulation flexibility.

  5. Produces tough, impact-resistant coatings and composites with low color formation and minimal blush.

Typical Applications Of Evonik IPDA Diamine Curing Agent

  1. High-performance protective coatings for industrial steel structures and marine environments.

  2. Structural adhesives requiring rapid strength build-up and excellent substrate adhesion.

  3. Electrical encapsulation and potting compounds for demanding electronic and power applications.

  4. Fiber-reinforced polymer (FRP) composites used in wind energy, automotive, and aerospace components.

  5. Self-leveling flooring systems where fast return-to-service and abrasion resistance are critical.

Specifications Of Evonik IPDA Diamine Curing Agent

Chemical TypeAliphatic diamine (Isophoronediamine)
Product FormLiquid
AppearanceColorless to pale yellow clear liquid
Amine Value410–430 mg KOH/g
Viscosity (25 °C)80–120 mPa·s
Density (20 °C)0.91–0.93 g/cm³
Primary ApplicationsEpoxy resin curing agent for coatings, adhesives, composites, and encapsulants
Key FeaturesFast cure, low temperature performance, low viscosity, high toughness


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