Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Wacker AP 200 Phenyl Silicone Fluid

Wacker AP 200 Phenyl Silicone Fluid is a high-purity, low-viscosity phenyl-containing silicone oil from Wacker’s AP series. It offers exceptional thermal stability, UV resistance, and compatibility with organic polymers. Widely used in coatings, adhesives, and specialty lubricants for enhanced durability and optical clarity. Non-volatile, colorless, and odorless.
  • wacker ap 200 phenyl silicone fluid_f6db6cc7
  • wacker ap 200 phenyl silicone fluid_f6db6cc7

Features Of Wacker AP 200 Phenyl Silicone Fluid

  1. High thermal stability with continuous service up to 200 °C

  2. Excellent UV and oxidative resistance for long-term outdoor performance

  3. Low volatility and high flash point, enhancing process safety and handling

  4. Superior compatibility with organic resins, pigments, and silicone elastomers

  5. Outstanding dielectric properties across wide temperature and frequency ranges

Typical Applications Of Wacker AP 200 Phenyl Silicone Fluid

  1. Heat-transfer fluids in high-temperature industrial circulation systems

  2. Base fluid for specialty lubricants in aerospace and automotive components

  3. Formulation ingredient in high-performance release agents for composite molding

  4. Dielectric coolant in power electronics and LED encapsulation systems

  5. Carrier fluid for thermal interface materials (TIMs) in EV battery modules

Specifications Of Wacker AP 200 Phenyl Silicone Fluid

Chemical TypePhenyl-substituted linear polydimethylsiloxane
Product FormClear, colorless to pale yellow liquid
AppearanceHomogeneous, transparent, free of sediment or haze
Viscosity (25 °C, cSt)Approx. 200
Density (25 °C, g/cm³)1.03–1.06
Flash Point (PMCC, °C)≥300
Refractive Index (25 °C)1.525–1.535
Key FeaturesThermally stable, non-volatile, electrically insulating, chemically inert


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *