High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and low dielectric loss for electronic encapsulation applications.
Good adhesion to metals, glass fibers, and common substrates without mandatory surface priming.
Electrical and electronic encapsulants for transformers, sensors, and power modules.
Structural adhesives in automotive and aerospace composite bonding systems.
Matrix resin for filament-wound pressure vessels and high-strength composite pipes.
Coating formulations for corrosion-resistant linings in chemical storage tanks.
Prepreg and infusion resins for wind turbine blade manufacturing.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, amber-colored liquid |
| Appearance | Homogeneous, transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Chloride Content | ≤ 1,000 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at 20–25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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