Low viscosity for excellent processability and easy handling in casting, potting, and impregnation operations.
High purity with minimal gel content, ensuring consistent reactivity and reliable crosslinking performance.
Optimized epoxy equivalent weight (EEW) for balanced cure speed and thermal-mechanical properties.
Good compatibility with common amine and anhydride curing agents used in industrial formulations.
Stable shelf life under recommended storage conditions (25 °C, dry, dark environment).
Electrical insulation systems for motors, transformers, and generators.
Potting and encapsulation of electronic components and PCBs.
Structural adhesives requiring high bond strength and environmental resistance.
Composite matrix resin for fiber-reinforced laminates in wind energy and transportation sectors.
Protective coatings for metal substrates in corrosion-prone industrial environments.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow low-viscosity liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 180–190 g/eq |
| Viscosity at 25 °C | 10,000–14,000 cP |
| Chloride Content | ≤ 700 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | ≥ 12 months at ≤ 25 °C in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China