Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Shikoku 2PZ-CN Epoxy Resin

Shikoku 2PZ-CN Epoxy Resin is a high-purity, low-viscosity liquid epoxy resin from Shikoku Chemicals’ 2PZ series, designed for advanced composites and electronic encapsulation. It offers excellent thermal stability, low halogen content, and superior adhesion to fillers and fibers. Widely used in aerospace prepregs, LED packaging, and high-reliability PCB laminates due to its consistent reactivity and low ionic impurities.
  • shikoku 2pz cn epoxy resin_3b709022
  • shikoku 2pz cn epoxy resin_3b709022

Features Of Shikoku 2PZ-CN Epoxy Resin

  1. Highly reactive bisphenol-F-based epoxy resin with enhanced thermal stability.

  2. Low viscosity at room temperature, enabling excellent processability and impregnation into fiber reinforcements.

  3. Excellent adhesion to carbon fiber, glass fiber, and metal substrates.

  4. Superior electrical insulation properties with low dielectric loss.

  5. Compatible with conventional amine and anhydride curing agents for tailored cure profiles.

Typical Applications Of Shikoku 2PZ-CN Epoxy Resin

  1. Aerospace composite structures requiring high Tg and dimensional stability.

  2. High-voltage electrical insulators and encapsulation compounds.

  3. Advanced wind turbine blade matrices with improved fatigue resistance.

  4. Prepreg systems for automated tape laying (ATL) and filament winding processes.

  5. High-performance printed circuit board (PCB) laminates and bonding films.

Specifications Of Shikoku 2PZ-CN Epoxy Resin

Chemical TypeBisphenol-F epoxy resin
Product FormLiquid
AppearancePale yellow to amber transparent liquid
Epoxy Equivalent Weight (EEW)165–175 g/eq
Viscosity (25°C)8,000–12,000 mPa·s
Chloride Content≤ 500 ppm
Volatiles Content≤ 0.3 wt%
Key FeaturesHigh reactivity, low moisture absorption, excellent hydrolytic stability


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *