Highly reactive bisphenol-F-based epoxy resin with enhanced thermal stability.
Low viscosity at room temperature, enabling excellent processability and impregnation into fiber reinforcements.
Excellent adhesion to carbon fiber, glass fiber, and metal substrates.
Superior electrical insulation properties with low dielectric loss.
Compatible with conventional amine and anhydride curing agents for tailored cure profiles.
Aerospace composite structures requiring high Tg and dimensional stability.
High-voltage electrical insulators and encapsulation compounds.
Advanced wind turbine blade matrices with improved fatigue resistance.
Prepreg systems for automated tape laying (ATL) and filament winding processes.
High-performance printed circuit board (PCB) laminates and bonding films.
| Chemical Type | Bisphenol-F epoxy resin |
| Product Form | Liquid |
| Appearance | Pale yellow to amber transparent liquid |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25°C) | 8,000–12,000 mPa·s |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Key Features | High reactivity, low moisture absorption, excellent hydrolytic stability |
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E-mail: wangxingqiang@ericwchem.com
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