High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing, impregnation, and bubble-free casting.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to alkalis, diluted acids, and aliphatic solvents after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Potting compound for power electronics, IGBT modules, and EV battery management systems.
Matrix resin for filament-wound composite pressure vessels and structural wind turbine components.
Underfill and glob-top material for semiconductor packaging and PCB protection.
Adhesive formulation for bonding dissimilar substrates in aerospace and rail transport assemblies.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, pale yellow viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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